Samsung Could Use This Material to Build Advanced AI Chips by 2028
Samsung is developing glass interposers to replace silicon in AI chips by 2028, aiming for better performance and lower production costs.. Glass interposers allow for 3D stacking of chiplets and improve signal, power, and thermal integrity, despite slightly higher temperatures.. Samsung is using smaller glass panels (under 100×100mm), trading off efficiency to potentially lead the market in this technology.. Production is expected to begin at Samsung’s Cheonan facility using panel-level packaging (PLP) instead of wafer-level packaging (WLP).. TSMC is also working on similar glass substrate technology and may begin production with Fan-Out Panel-Level Packaging (FOPLP) by 2027..
